耐高温芯片倒装底填胶CV5300AK01EPS

耐高温芯片倒装底填胶CV5300AK01EPS
Liquid encapsulant materials

CV5300AK

TECHNICAL INFORMATION

Encapsulation Materials Department Plastic Materials Business Unit Electronic Materials Business Division

Panasonic Industory Co., Ltd

This is one component epoxy for Flip-chip underfilling.

TYPICAL PROPERTIES

Properties

Unit

Data

Test Method

Viscosity(25oC)

Pa*s

20

KES-B-0102

Gelation time

sec

800

EKS-B-1051

RECOMMENDING PREHEAT CONDITION

temperature of substrate : 80～120oC

temperature of syringe : R.T.～ 60oC

TYPICAL CURED PROPERTIES

Measurement Cure Conditions : 100'C2hour + 150`C 2hour

・Stored compound must be thawed before use. Warm at room temperature until no longer cool to touch (about 2hrs).

・Please use up the material within 12 hrs.

・Compound must be stored in the cool condition with sealing.

・Please keep material under -40oC after receiving product.

ATTENTION TO HANDLING

・Please avoid direct contact with this product by wearing gloves, protecting gears,etc.

・Prevent frequent skin contact. If contact occurs, wash immediately with soap and water.

耐高温芯片倒装底填胶CV5300AK01EPS